{"created":"2023-05-15T11:03:59.111153+00:00","id":146,"links":{},"metadata":{"_buckets":{"deposit":"22d3cf29-b1d0-4de5-954f-d02db251a6c8"},"_deposit":{"created_by":15,"id":"146","owners":[15],"pid":{"revision_id":0,"type":"depid","value":"146"},"status":"published"},"_oai":{"id":"oai:u-aizu.repo.nii.ac.jp:00000146","sets":["3:48"]},"author_link":["110","113"],"control_number":"146","item_10006_date_granted_11":{"attribute_name":"学位授与年月日","attribute_value_mlt":[{"subitem_dategranted":"2017-09-15"}]},"item_10006_degree_grantor_9":{"attribute_name":"学位授与機関","attribute_value_mlt":[{"subitem_degreegrantor":[{"subitem_degreegrantor_name":"会津大学"}],"subitem_degreegrantor_identifier":[{"subitem_degreegrantor_identifier_name":"21602","subitem_degreegrantor_identifier_scheme":"kakenhi"}]}]},"item_10006_degree_name_8":{"attribute_name":"学位名","attribute_value_mlt":[{"subitem_degreename":"博士（コンピュータ理工学）"}]},"item_10006_description_10":{"attribute_name":"学位授与年度","attribute_value_mlt":[{"subitem_description":"平成29年度","subitem_description_type":"Other"}]},"item_10006_description_17":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"PDF","subitem_description_type":"Other"}]},"item_10006_dissertation_number_12":{"attribute_name":"学位授与番号","attribute_value_mlt":[{"subitem_dissertationnumber":"甲CI博第60号"}]},"item_10006_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.15016/00000140","subitem_identifier_reg_type":"JaLC"}]},"item_10006_version_type_18":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"open access"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"ダン, ナム カイン","creatorNameLang":"ja"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Dang, Nam Khanh","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2017-11-01"}],"displaytype":"detail","filename":"d8162103.pdf","filesize":[{"value":"17.0 MB"}],"format":"application/pdf","licensetype":"license_11","mimetype":"application/pdf","url":{"label":"d8162103","objectType":"fulltext","url":"https://u-aizu.repo.nii.ac.jp/record/146/files/d8162103.pdf"},"version_id":"97eec800-2796-440f-8b96-241c37421f9b"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"3D Integrated Circuits","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"3D Network-on-Chip","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Fault-Tolerance","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Reliability Assessment","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Through Silicon Vias","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Soft-Errors","subitem_subject_language":"en","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"doctoral thesis"}]},"item_title":"3次元IC技術のための適応型耐障害チップ内通信アーキテクチャとアルゴリズムの開発","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"3次元IC技術のための適応型耐障害チップ内通信アーキテクチャとアルゴリズムの開発","subitem_title_language":"ja"},{"subitem_title":"Development of On-Chip Communication Fault-Resilient Adaptive Architectures and Algorithms for 3D-IC Technologies","subitem_title_language":"en"}]},"item_type_id":"10006","owner":"15","path":["48"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2017-11-01"},"publish_date":"2017-11-01","publish_status":"0","recid":"146","relation_version_is_last":true,"title":["3次元IC技術のための適応型耐障害チップ内通信アーキテクチャとアルゴリズムの開発"],"weko_creator_id":"15","weko_shared_id":-1},"updated":"2023-06-26T01:15:46.897004+00:00"}